- November 30, 2020
- 0 Comment
- By admin

LMT/NOPB Texas Instruments Audio Amplifiers Overture Audio Pwr Amp Series Dual 40W datasheet, inventory, & pricing. LMT Texas Instruments Audio Amplifiers datasheet, inventory, & pricing. LMT LM – Overture Audio Power Amplifier Series Dual Watt Audio Power Amplifier With Mute, Package: to , Pin Nb=15 LM OvertureTM.

Author: | Kazil Galkree |

Country: | Iran |

Language: | English (Spanish) |

Genre: | Relationship |

Published (Last): | 19 June 2007 |

Pages: | 137 |

PDF File Size: | 18.52 Mb |

ePub File Size: | 4.8 Mb |

ISBN: | 909-4-37642-825-6 |

Downloads: | 90499 |

Price: | Free* [*Free Regsitration Required] |

Uploader: | Zolor |

Refer to the graphs of Power Dissipation versus Output Power in the Typical Performance Characteristics section which show the actual full range of power dissipation not just the maximum theoretical point that results from Equation 1.

The LM has a sophisticated thermal protection scheme. SPiKe Protection Circuitry is not enabled. SPiKe Protection means that these parts are safeguarded at the output against overvoltage, lm47666t dervoltage, overloads, including thermal runaway and in- stantaneous temperature peaks. Typical Audio Amplifier Application Circuit. The LM is protected from instantaneous peak. Upon system power-up, the under-voltage protection cir. The clamping effect is quite the same, however, the output transistors are designed to work alter- nately by sinking large current spikes.

Equation 1 exemplifies the theoretical maximum power dis- sipation point of each amplifier where V CC is the total supply voltage. An incorrect maximum power dissipation calculation may result in inad- equate heat sinking causing thermal shutdown and thus lim- iting the output power.

Equation 1 exemplifies the theoretical maximum power dis. LM should have its supply leads bypassed with. Since the die temperature is directly dependent upon the heat sink used, the heat sink should be chosen such that thermal shutdown will not be reached during normal opera- tion.

Refer to the graphs of Power Dissipation versus. Since the die temperature is directly dependent upon the. However, to improve system performance as well as eliminate possible oscillations, the LM should have its supply leads bypassed with low-inductance capacitors having short leads that are lo- cated close to the package terminals. Power dissipation within the integrated circuit package is a.

The package dissipation is twice the number which re- sults from Equation 1 since there are two amplifiers in each LM Each amplifier within the LM has an independent.

Single Supply Application Circuit. Please refer to AN for more detailed information. The LM contains over-voltage protection circuitry that. Since convection heat flow power dissipation is analogous to current flow, thermal resistance is analogous to electrical resistance, and tem- perature drops are analogous to voltage drops, the power dissipation out of the LM is equal to the following: Operating graph in the Typical Performance Characteris.

Using the best heat sink possible within the cost and. Output Power in the Typical Performance Characteristics. This calculation is made using Equation 3. Once the maximum package power dissipation has been. This greatly reduces the stress imposed on the IC by. The choice of a heat sink for a high-power audio amplifier is. The waveform to the right of the SOA graph exemplifies how the dynamic pro- tection will cause waveform distortion when enabled.

Using the best heat sink possible within the cost and space constraints of the system will improve the long-term reliability of any power semiconductor device, as discussed in the Determining the Correct Heat Sink Section. The clamping effect is quite the same. Special Audio Amplifier Application Circuit. Special Audio Amplifier Application Circuit 5 www. However, to improve system.

The LM has excellent power supply rejection and does. This greatly reduces the stress imposed on the IC by thermal cycling, which in turn improves its reliability under sustained fault conditions.

The thermal resistance from the die junction to the outside. Upon turn-off, the output of the LM is brought to ground be- fore the power supplies such that no transients occur at power-down.

Thus by knowing the total supply voltage and rated output load, the maximum power dissipation point can be calcu- lated. Single Supply Amplifier Application Circuit. The package dissipation is twice the number which re. Auxiliary Amplifier Application Circuit. Taking into account supply line fluc- tuations, it is a good idea to pull out 1 datsaheet per mute pin or 2 mA total if both pins are tied together.

Taking into account supply line fluc. SPiKe Protection means that these.

Thus by knowing the total supply voltage and rated output. Numbers in parentheses represent pinout for amplifier B. These instabilities can be eliminated through multiple. It starts operating again when the die temperature. The LM is a stereo audio amplifier capable of delivering.

This website uses cookies to improve your experience. We'll assume you're ok with this, but you can opt-out if you wish. Cookie settingsACCEPT

Privacy & Cookies Policy

This website uses cookies to improve your experience while you navigate through the website. Out of these cookies, the cookies that are categorized as necessary are stored on your browser as they are as essential for the working of basic functionalities of the website. We also use third-party cookies that help us analyze and understand how you use this website. These cookies will be stored in your browser only with your consent. You also have the option to opt-out of these cookies. But opting out of some of these cookies may have an effect on your browsing experience.